Oxford CMI 563

Oxford/CMI CMI 563

Oxford Instruments CMI-563 measures surface copper thickness applications to serve the quality control needs of the Printed Circuit Board industry. 

·         Measures the thickness of copper foil on rigid, flexible, single- and double-sided or multi-layer PCBs 

·         Measures foil or laminated copper thickness in mils or µm 

·         Sorts copper by weight at incoming inspection, before drilling, shearing or plating 

·         Determines electroless or electroplated Cu thickness on PCBs 

·         Accurately quantifies copper thickness after etching or planarizing 

·         Verifies copper plating thickness on PCB surface

The probe utilizes Oxford Instruments proprietary SRP-4 microresistance technology, featuring economical user-replaceable measurement tips.

Features:

·         Rugged hand-held 16-button unit featuring a large 4-digit LCD display 

·         Features Oxford Instruments proprietary, economical, user-replaceable SRP-4 probe tips that can be easily replaced on site minimizing downtime 

·         Contains fine-line measurement algorithm for measuring on Cu traces 

·         RS-232 serial port output for a printer or PC download 

·         Statistical data analysis and reporting with memory location, number of readings, Cu type, date-time stamping, mean, standard deviation, accuracy, high, low, range, cpk, and histogram

Includes: Hand held unit with carry case, measurement probe and NIST traceable calibration standards

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