Oxford CMI 760

Oxford/CMI CMI 760E & 760EN

The CMI760 and CMI760N packages measure surface copper thickness applications to serve the quality control needs of the Printed Circuit Board industry.

·         Measures copper thickness on PCBs 

·         Measures foil or laminated copper thickness in mils, µm or copper weight (oz) 

·         Determines electroless or electroplated Cu thickness on PCBs 

·         Accurately quantifies copper thickness after etching or planarizing 

·         Verifies copper plating thickness on PCB surface

The CMI760 and CMI760N packages measure surface copper thickness applications to serve the quality control needs of the Printed Circuit Board industry. The probe utilizes Oxford Instruments proprietary SRP-4 microresistance technology featuring user-replaceable measurement tips for the standard (CMI760, SRP-4) or narrow (CMI760N, SRP-4N) varieties.

Features:

·         Measures copper thickness on PCBs

·         Measures foil or laminated copper thickness in mils, µm or copper weight (oz)

·         Determines electroless or electroplated Cu thickness on PCBs

·         Accurately quantifies copper thickness after etching or planarizing

·         Verifies copper plating thickness on PCB surface

·         CPU unit features a high contrast color LCD display

·         Memory to store up to 5000 measurements, parameters and calibrations

·         R232 PC connectivity

·         Parrelel printer port

·         Multi-level user password security system

·         Statistical data analysis with histogram, X-bar, R-chart and trend charts, which can be viewed on the display or printed direct from the instrument

Includes: CPU Unit, probe and NIST traceable calibration standards

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Mr.The Thuc  (+84)-988983298

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Email : nt.thuc@ntd-automation.com